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Materials Science at Oregon State University

Porous Silicon: An Enabling Material for Microsystem Integration - PLEASE NOTE: Seminar in KEC 1001 at 4:00 pm

Date: Monday, Jun 1st
Presenter: Dr. Paul L. Bergstrom, Department of Electrical and Computer Engineering, Michigan Technological University

Abstract


This presentation will explore how porous materials, and porous silicon in particular, may be utilized in many microsystem applications that benefit society. An exploration of the processes and fabrication technologies required to utilize porous silicon in applications will be presented through an overview of the porous silicon research underway at Michigan Technological University in Dr. Bergstrom?s research group. The seminar will present the formation of porous silicon by electrochemical anodization and process control parameters impacting the morphology of the resulting material. Nanoporous, mesoporous, and macro porous silicon in various orientations will be presented. Applications under current investigation will be considered, including submicron particulate filtration, reference evaporation and adsorption preconcentration sources developed for the Environmental Monitoring Testbed under the NSF Engineering Research Center for Wireless Integrated Microsystems, microfluidic devices, chemical and biological sensing, and other micro electro mechanical system (MEMS) devices based on a variety of porous silicon morphologies.