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Materials Science at Oregon State University

The Applications of Tecnai G2 and FEI TEM Family

Date: Thursday, Apr 15th
Presenter: Lianfeng Fu, Ph. D., FEI Company, Hillsboro, OR

Abstract


The physical properties of nanomaterials are strongly correlated with their microstructure, especially the real structure with interfaces and defects, not just the ideal crystalline structure. A thorough understanding of interfaces and defects is of importance for understanding and improving their physical properties. Transmission electron microscopy (TEM) is the key to understand these microstructures down to the atomic level. Different techniques are usually included in the TEM field, such as High Resolution Transmission Electron Microscopy (HRTEM), Scanning Transmission Electron Microscopy (STEM) or Z-contrast Imaging, Energy dispersive X-ray (EDX), Electron Energy loss spectroscopy (EELS), and 3-Dimension Electron Tomography (ET). The FEI Tecnai G2 (scanning) transmission electron microscope is a universal imaging and analysis solution that allows you to perform all the advanced analytic techniques in a single microscope. The user can benefit from true digital control and 3rd party integrated and embedded systems. All microscope functions can be digitally controlled and centralized in a single imaging and analysis environment. Besides Tecnai, FEI TEM families such as Spirit, Titan, and Tecnai Osiris will be briefly described.

Biography

Dr. Lianfeng Fu joined FEI Company in January, 2007 as a senior TEM Research Scientist specializing in materials science. He earned his Ph.D. degree in Materials Science from the University of California at Davis (UC-Davis) in December 2006. He was a group member of Dr. Nigel D. Browning's Interface Physics Group at UC-Davis and a visiting Scientist at the National Center for Electron Microscopy (NCEM) at Lawrence Berkeley National Laboratory (LBNL) from 2003 to 2006. Over the last 10 years he has been working on the interface physics of advanced materials, such as memory storage, superconductors, oxide semiconductors, and nanometer alloys using electron microscopy techniques (dual beam FIB, HRTEM, STEM, HAADF Z-contrast, EELS, and tomography). His current work includes applications development for FEI Tecnai, Tecnai Osiris, and Titan series microscopes in materials science.